Engineering envelope
Per platform
4.8
KW
CRPS output
270
W
CPU TDP
300
W
Per GPU
32
LRDIMM slots
10
PCIe cards
Cold / hot air isolation tunnel
Chassis platforms
4 formats
2U
8-Bay
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Hot-swap front bays
2U
12-Bay
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Hot-swap front bays
4U
16/24-Bay
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Hot-swap front bays
4U
36-Bay
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Hot-swap front bays
Chassis specification
From the company profile
Processor
Single / Dual 1st / 2nd Gen Intel Xeon Scalable, TDP up to 205W
Memory
Up to 24 DDR4 slots, 2400 / 2666 / 2933 MHz
OS drives
2 × 480GB Enterprise SSD, RAID 1
Storage
Front 8 × hot-swap 3.5" / 2.5" SAS / SATA / NVMe · rear optional 2×2×3.5" or 2×2×2.5"
Expansion
3 × PCIe 3.0 slots, up to 11 PCIe 3.0 lanes for 2 × double-width full-length GPUs
Power
AC 220V, 550W–2200W redundant CRPS
Ports
Front 1 VGA, 2 USB3.0 · rear 1 VGA, 1 COM, 2 USB3.0, 1 mgmt RJ45, 2 GbE RJ45
Environment
5°C–35°C, 20%–80% RH non-condensing
Dimensions (4U)
798 × 433.4 × 176.5 mm (D × W × H)
Thermal
Cold / hot air isolation tunnel
Intake and exhaust paths are separated through the chassis so drive banks are not fed by air that has already crossed the CPUs.
Expansion
Up to 10 PCIe cards
6 full-height and 4 half-height, so capture, networking and GPU analytics can share one chassis.
Memory
32 LRDIMM slots
Headroom for VMS, analytics and database workloads running alongside the recording path.
Placeholder
Two CPU TDP figures exist in the source material — the chassis specification says up to 205W, while the engineering figures say 270W. Both are shown above as supplied. Confirm which applies to which platform before this page goes live.
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